Hybrid electronics packages
In this section
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Applications
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Structural products
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Wafer products
Product description
Control expansion (CE) alloy hybrid electronics package for flight application where lightweight is essential
Application area
Microwave detection
CE alloy used
Osprey® CE13F
Material replaced
New application
Advantages of using Osprey® CE13F controlled expansion alloy
- Weight-saving versus other materials
- High thermal conductivity