Thermal management products
Controlled expansion alloys can be used for the manufacturing of thermal management and electronic packaging components in application areas, such as, aerospace, space and telecommunications. Below are examples of components that controlled expansion alloys are suitable for.
Hermetic housings and packages (microwave - RF)
- Amplifier housings
- Housings for radar circuitry
- Hybrid electronics packages
- Transmit receive modules
Non-hermetic housings, carriers and heat zinks
Carrier plates
Embedded computer products