Silicon (Si) wafer chucks, discs, platens and other semiconductor processing equipment in controlled expansion (CE) alloy.
Product description (example of product)
Semiconductor chuck with diffusion-bonded cooling channels
CE alloy used
Advantages of using Osprey® CE6F controlled expansion alloy
- Low thermal expansion with high thermal stability
- Good thermal conductivity and high stiffness
- Possibility to incorporate internal cooling channels into the component using diffusion bonding