Applications
Components made from Osprey® CE (controlled expansion) alloys improve product performance and reliability in many areas. Typical applications include stiff structural products, thermal management product, and wafers.
Thermal management products
In aerospace, space and telecommunications applications, controlled expansion alloys can be used in thermal management and electronic packaging components such as:
- Amplifier housings
- Carrier plates
- Housings for radar circuitry
- Hybrid electronics packages
- Optical housings
- PCB guide bars
- Resistor tubs
- RF transmit modules
- Sensor mounts
- Transmit receive modules
Structural products
Stiff structural products are used in, for example, optical systems, electronics assembly, and semiconductor processing equipment. Examples of such products include:
- Bearing housings
- Lens holders
- Semiconductor chucks
- Wire bonders and other products for use in rapid-moving equipment
Wafer products
Wafers up to 12” diameter supplied as lapped, polished or polished and metallized wafers, expansion matched to compound semiconductor materials. Alloys chosen are typically Osprey® CE6F and CE7F, and these are used to replace sapphire – GaAs. Our alloy wafers are used for medium and high brightness LED, and photovoltaic cells.