Osprey® CE13F AlSi alloy

Osprey® CE13F is an Aluminium Silicon (AlSi) Alloy with controlled thermal expansion and high specific stiffness. It is used in applications where low weight, high stiffness or controlled thermal expansion (CTE) is required.

Characteristics of Osprey® CE13F AlSi alloy

Offers improved CTE matching to electronic circuit boards when compared to aluminium or copper
In some use cases, a reliable carrier for most ceramic substrates and device materials, including alumina and GaAs
One third the weight of Copper
Weldable, machinable and plateable
Lower cost to machine than Osprey® alloys CE11F, CE9F, CE7F or CE6F

Typical applications

Application examples include space optics applications where Osprey® CE13F is a close CTE match to electroless nickel which is used for optical surfaces. Osprey® CE13F is also widely used for semi-conductor pick and place applications where high specific stiffness improves speed and accuracy.

Mechanical properties

Mechanical properties, typical values
	CE17F	CE17MF	CE13F	CE11F	CE9F	CE7F	CE6F
Composition	Al-27%Si	Al-27%Si	Al-42%Si	Al-50%Si	Si-40%Al	Si-30%Al	Si-20%Al
Tensile strength, ultimate	≥160	175-312³⁾	205	193	181	≥100	N/A
Yield strength, MPa	100	282	147	189	-	-	N/A
Bend strength (three point), Mpa	-	-	300	300	300	270	319¹⁾
Young's modulus, GPa	91.8	91.8²⁾	101.9	121.4	118	129.2	130
Rigidity modulus, GPa	35.8	35.8²⁾	42.2²⁾	48.6	46	51.6	N/A
Poisson's ratio	0.28	0.28²⁾	0.27²⁾	0.29	0.29	0.26	N/A
Density, g/cc	2.6	2.6	2.55	2.51	2.47	2.43	2.35²⁾
Hardness, Hv	60	75–132³⁾	90	-	230	-	N/A

1) Test pieces 4 mm x 3 mm x 40 mm
2) Calculated values
3) Depending on heat treatment condition

Thermal expansion

Coefficient of thermal expansion, ppm/ºC (typical values)
	CE17F	CE17MF	CE13F	CE11F	CE9F	CE7F
Composition¹⁾	Al-25%Si	Al-27%Si	Al-42%Si	Al-50%Si	Si-40%Al	Si-30%Al
100K–200K	-	-	-	7.8	-	-
200K–300K	-	-	-	10.6	-	-
100K–300K	-	-	-	9.2	-	-
-60–200ºC	-	-	-	11.6	-	7.6
Room temp.	15.3	15.3	12.2	11.4	9.1	7.2
25–200ºC	17.1	17.1	13.7	12.3	10.2	8.3
25–300ºC	18.1	18.1	14.6	12.9	10.9	8.8
25–400ºC	18.7	18.7	15.2	13.4	11.3	9.2
25–500ºC	19	19	15.5	13.7	11.4	9.7

^* Calculated values

Thermal conductivity

Thermal conductivity, W/m.K (typical values)
	CE17F	CE17MF	CE13F	CE11F	CE9F	CE7F
Composition¹⁾	Al-25%Si	Al-27%Si	Al-42%Si	Al-50%Si	Si-40%Al	Si-30%Al
At -100ºC	-	-	-	-	-	180
At -50ºC	-	-	-	-	129²⁾	140
At -0ºC	-	-	-	-	-	135
At 25ºC	177.4	146.8	145	132	121	120
At 50ºC	-	-	-	-	-	110
At 100ºC	-	-	-	-	125^*	110
At 200ºC	151.2	146.5	-	-	108^*	100
At 300ºC	-	-	-	-	98^*	88
At 400ºC	-	-	-	-	90^*	80
At 500ºC	-	-	-	-	85^*	75
Specific heat, J/kgºC	846.3	767.25	857^*	754^*	780^*	785^*

^* Calculated values

Microstructure

Microstructure of CE alloys

In the molten state Si and Al are mutually soluble, whereas in the rapidly solidified condition there is minimal solubility of Si in Al (< 0.3%) and even less solubility of Al in Si. The products are true alloys rather than metal-matrix composites (such as AlSiC) as all the phases present originate from an homogeneous melt.

The Al phase is continuous up to ~ 85%Al. Over approximately 40% Si, the Si phase also becomes continuous, offering a co-continuous duplex alloy (similar to AlBe alloys).

The continuous Si phase produces a stiff alloy with low thermal expansion and low internal stresses, whereas the continuous Al phase enhances thermal conductivity and toughness and lowers electrical resistance.

Consequently, as the Al content is increased, electrical conductivity, thermal conductivity, strength, toughness, CTE and machinability are also increased. For these reasons, it is best to choose the highest Al content alloy that is acceptable for the application.

Although Sandvik can supply machined components with Si contents as high as 85% Si (i.e. CE5), the relative brittleness of this composition means whenever feasible it is often better to compromise on the exact expansion match required and use a lower Si content alloy. For example, Kovar^* packages (with a CTE of ~ 7ppm/°C) have been successfully replaced with CE9, CE11 and even CE13.

^* Kovar is a trademark of Carpenter Technology Corporation