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Working with CE alloys

The techniques for working with different CE (controlled expansion) alloys can vary markedly. View recommendations for e.g. design, machining, welding and plating.

RF transmit modules

RF transmitter/receiver modules made from our Osprey® CE7F controlled expansion alloy are expansion matched to LTCC and are manufactured at a low cost.

Transmit receive modules

Transmit receive modules made from Osprey® CE11F controlled expansion alloy are lighter, require fewer manufacturing steps and have six times the thermal conductivity of titanium.

Design guidelines

CE alloys are relatively brittle and therefore the design of components must be carefully controlled to achieve optimum results.


We have developed machining conditions and tooling especially for CE alloys, enabling us to supply CNC and/or EDM machined components.

Carrier plates

Carrier plates made from Osprey® CE17F controlled expansion alloy offer high specific stiffness and improved CTE match to PCB laminate.

Plating and surface treatment

In most cases, any plating or coating technique and any coating material that is normally applied to Si or Al alloys can be used on the CE alloys.

Amplifier housings

Amplifier housings made of Osprey® controlled expansion alloy CE11F require fewer manufacturing steps and offer a lightweight product, fit for satellite applications.

Optical housings

Osprey® CE11F controlled expansion alloy is perfect for the manufacturing of optical housings. It offers specific stiffness, dimensional stability and is three times lighter than steel.

Soldering, brazing and feedthroughs

Recommendations for soldering, brazing and feedthroughs in controlled expansion alloys (CE alloys).

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