Semiconductor chucks in CE alloys

Silicon (Si) wafer chucks, discs, platens and other semiconductor processing equipment in controlled expansion (CE) alloy.

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Product description (example of product)

Semiconductor chuck with diffusion-bonded cooling channels

Application area

X-ray imaging

CE alloy used

Osprey® CE6F

Advantages of using Osprey® CE6F controlled expansion alloy

  • Low thermal expansion with high thermal stability
  • Good thermal conductivity and high stiffness
  • Possibility to incorporate internal cooling channels into the component using diffusion bonding

Developing and producing equipment such as wire bonders for the assembly of semiconductors requires advanced knowledge and precision.