Semiconductor chucks in CE alloys

Silicon (Si) wafer chucks, discs, platens and other semiconductor processing equipment in controlled expansion (CE) alloy.

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Product description (example of product)

Semiconductor chuck with diffusion-bonded cooling channels

Application area

X-ray imaging

CE alloy used

Osprey® CE6F

Advantages of using Osprey® CE6F controlled expansion alloy

  • Low thermal expansion with high thermal stability
  • Good thermal conductivity and high stiffness
  • Possibility to incorporate internal cooling channels into the component using diffusion bonding

Increasing precision of semiconductor assembly equipment

Developing and producing equipment such as wire bonders for the assembly of semiconductors requires advanced knowledge and precision.