Components made from Osprey® CE (controlled expansion) alloys improve product performance and reliability in many areas. Typical applications are stiff structural products, thermal management products and wafers.

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Structural products

Stiff structural products in, for example, optical systems, electronics assembly and semiconductor processing equipment. Examples are:


Wafers up to 12” diameter supplied as lapped, polished or polished and metallized wafers, expansion matched to compound semiconductor materials.

Our alloy wafers are used for:

  • Medium and high brightness LED
  • Photovoltaic cells

Alloys chosen are typically Osprey® CE6F and CE7F, and these are used to replace sapphire – GaAs.

Advantages of Osprey® CE6F controlled expansion alloy

  • CTE matching of compound semiconductor materials
  • Superior thermal and electrical properties
  • Enhanced reliability
  • Low cost

Technical specification for wafers and comparative property data

Thermal management products

Thermal management and electronic packaging components in application areas, such as, aerospace, space and telecommunications. Examples are:

Hermetic housings and packages (microwave - RF)

Non-hermetic housings, carriers and heat zinks

Carrier plates

Embedded computer products

Compare with other materials

Osprey® CE alloys are lighter and also offer other advantages compared to many competitive materials.

View comparison table

Working with CE alloys

Find information on, for example, machining, welding and plating.

Learn about processing of CE alloys

FAQ about CE alloys

Want to know more? View the most frequently asked questions about controlled expansion alloys (CE alloys).

Go to the FAQ page

Proven performance

Our alloys improve component performance all the way from earth to outer space.

View cases in brief