Compare CE alloys with other materials
Osprey® CE alloys offer many advantages compared to most competitive materials. For example, CE alloys are lighter and have controlled expansion coefficients at any preselected value in the range 5 to 17 ppm/°C.
Below you find comparisons with other materials used in various thermal management and packaging applications.
|Competitive materials||Osprey® CE alloys|
|Aluminium alloys (e.g. 6061)||Osprey CE17F is 5% lighter, 30% stiffer and has a lower coefficient of thermal expansion (CTE) than 6061 Al alloy, similar to many laminate board materials (e.g. FR4). Osprey CE17F is also less prone to burring.|
|Aluminium- silicon-carbide (AlSiC)||Osprey CE7F and CE9F do not require mould tools, thus prototypes can be delivered quickly and with much lower setting-up costs. Osprey CE7F/CE9F are readily machinable and plateable.|
|Beryllium-beryllium oxide (Be-BeO)||Osprey CE alloys are environmentally friendly and non-toxic.|
|Copper||Osprey CE17F is 1/4 the weight, stronger and easier to machine.|
|Copper-85% tungsten (CuW)||Osprey CE7F uses significantly lower-cost raw materials and is 1/6 the density.|
|Copper-85% molybdenum (CuMo)||Osprey CE7F uses significantly lower cost raw materials and is 1/4 the density.|
|Kovar* (FeNiCo)||Osprey CE7F and CE9F housings are comparable in price but are 1/3 the density and have 6–9 x thermal conductivity, eliminating the need for heat sinks. Osprey CE7F/CE9F do not normally require heat treating and do not burr.|
|Steel||Osprey CE13F/CE11F have similar CTEs but are 1/3 the density.|
|Titanium||Osprey CE9F or CE11F are 1/2 the density and have 6x the thermal conductivity.|
*Kovar is a trademark of CRS Holding.